SK Hynix, one of the world’s leading memory chip makers, showcased its latest innovations in flash memory technology at the 2023 Flash Memory Summit (FMS), held from August 21 to 24 in Santa Clara, California. The company announced that it had developed the world’s first 321-layer NAND flash, as well as its plans to launch CXL-based products and UFS QLC products under its Solidigm subsidiary.
SK Hynix Breaks the Record with 321-Layer NAND Flash
SK Hynix’s Executive VP of NAND Development, Jungdal Choi, delivered a keynote speech on the company’s “4D” NAND technology, which integrates the cell array and the peripheral circuitry in a single chip. SK Hynix currently offers the highest NAND flash stack count at 238 layers, as well as a 30% reduction in the size of logic under the NAND cells from the company’s previous generation product.
The company announced that it had successfully fabricated the first 321-layer NAND flash, breaking the record for the highest number of layers in a single chip. This was achieved by correctly overlaying three plugs of cell holes and developing a stress-free material to enable higher layer stacks. SK Hynix plans to start transferring its 321-layer NAND into mass production starting in the first half of 2025.
The 321-layer NAND product provides 41% bit growth, 13% lower read latency, 12% faster program performance and 10% better read power efficiency compared to the previous generation. In order to provide higher capacities and performance required for AI workflows, the company is developing multi-site cells and shared bit lines to enable five bit per cell (PLC) write times that equal three bit per cell (TLC) NAND. SK Hynix sees this as a path enabling higher bit per cell implementation in future NAND generations.
SK Hynix Introduces CXL Products for Data-Centric Computing
SK Hynix also revealed its roadmap for CXL-based products, which are designed to support data-centric computing in cloud and enterprise environments. CXL, or Compute Express Link, is a new interconnect standard that enables high-speed and low-latency communication between processors and memory devices. CXL allows memory devices to act as an extension of the processor’s memory space, enabling faster data processing and reduced power consumption.
SK Hynix is developing CXL-based DDR5 modules, which will offer up to four times higher bandwidth and two times lower latency than DDR4 modules. The company is also working on CXL-based persistent memory modules, which will combine DRAM and NAND flash to provide high capacity and performance for data-intensive applications. SK Hynix expects to launch its CXL products in 2025.
SK Hynix Launches UFS QLC Products under Solidigm Brand
SK Hynix also announced that it had launched UFS QLC products under its Solidigm brand, which is dedicated to providing flash solutions for mobile devices. UFS, or Universal Flash Storage, is a standard for embedded flash memory that offers high performance and low power consumption. QLC, or Quad Level Cell, is a technology that stores four bits of data in a single cell, increasing the storage density and lowering the cost per bit.
SK Hynix’s UFS QLC products are based on its V7 4D NAND technology, which features 238-layer stacks and multi-site cells. The products offer up to 1 TB of storage capacity and up to 1 GB/s of sequential read speed. The products also support UFS 4.0 and UFS 5.0 standards, which provide improved features such as H-TPU (Host Turbo Write Performance Booster) and E2E HW automation.
SK Hynix is targeting its UFS QLC products for various applications such as smartphones, tablets, laptops, gaming consoles and automotive systems. The company claims that its products can meet the diverse needs of customers who demand high performance, high capacity and low power consumption.
SK Hynix Demonstrates Its Leadership in Flash Memory Technology
SK Hynix’s announcements at the 2023 FMS demonstrate its leadership in flash memory technology and its commitment to delivering innovative solutions for various markets. The company is investing heavily in research and development to stay ahead of the competition and meet the growing demand for flash memory in the era of big data and AI.
SK Hynix is also collaborating with other industry players to promote open standards and interoperability for flash memory products. The company is a member of several industry associations such as JEDEC, ONFI, SNIA, NVM Express and CXL Consortium. SK Hynix aims to contribute to the advancement of flash memory technology and create value for its customers and partners.
